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XCVM1302-1LLIVSVD1760
- Part Number:
- XCVM1302-1LLIVSVD1760
- Category:
- Integrated Circuits (ICs) / Embedded / System On Chip (SoC)
- Manufacturer:
- AMD
- Description:
- IC VERSALPRIME ACAP FPGA 1760BGA
- Encapsulation:
- -
- Package:
- Tray
- Quantity:
- 0
- RoHS Status:
- Supported
- PDF:
- -
MOQ: 1
| Qty | Price | Total |
|---|---|---|
| 1+ | $7257.25 | $7257.25 |
Product Parameters
| Part Status | Active |
|---|---|
| Operating Temperature | -40°C ~ 100°C (TJ) |
| RAM Size | - |
| Flash Size | - |
| Number of I/O | 402 |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MPU, FPGA |
| Speed | 400MHz, 1GHz |
| Peripherals | DDR, DMA, PCIe |
| Core Processor | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ |
| Package / Case | 1760-BFBGA, FCBGA |
| Supplier Device Package | 1760-FCBGA (40x40) |
| Primary Attributes | Versal™ Prime FPGA, 70k Logic Cells |
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