TDA3MDDBABFQ1

Part Number:
TDA3MDDBABFQ1
Manufacturer:
Texas Instruments
Description:
LOW POWER SOC W/ FULL-FEATURED P
Encapsulation:
-
Package:
Tape & Reel (TR)
Quantity:
0
RoHS Status:
Supported
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MOQ: 0

Qty Price Total
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Product Parameters

Part Status Active
Operating Temperature -40°C ~ 125°C (TJ)
Primary Attributes -
RAM Size 512KB
Peripherals DMA, POR, PWM, WDT
Flash Size -
Number of I/O 126
Package / Case 367-BFBGA, FCBGA
Supplier Device Package 367-FCBGA (15x15)
Architecture DSP, MPU
Core Processor ARM® Cortex®-M4, C66x
Connectivity CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB
Speed 212.8MHz, 500MHz